Copper-clad Polyimide Film Used for Flexible Printed Circuits and Cable Assemblies(FPCs)

Short Description:

Product Description Copper-clad polyimide film is polyimide film laminated with copper foil which widely used as flexible printed circuits (FPCs). It has excellent physical, chemical, and electrical properties, atomic radiation resistant, solvent resistant, low & high temperature resistant, and performs successfully in the wide range of temperature as low as -452F(-269c) and as high as +752F(+400c). Because of its unique excellent properties, it is the most ideal choice in many insulation...


  • Die Cutting: Available
  • Customized Solution: Available
  • Factory Inspection: Available
  • Samples Delivery day: 3 days by air express
  • Certification: SGS, ROSH, ISO
  • Product Detail

    Product Tags

    Product Description

    Copper-clad polyimide film is polyimide film laminated with copper foil which widely used as flexible printed circuits (FPCs). It has excellent physical, chemical, and electrical properties, atomic radiation resistant, solvent resistant, low & high temperature resistant, and performs successfully in the wide range of temperature as low as -452F(-269c) and as high as +752F(+400c). Because of its unique excellent properties, it is the most ideal choice in many insulation applications.

    Structures

    Cu foil
     PI Film

    Features

    • Easy coating property.
    • Flame, Radiation, retardant property.
    • High temperature electrical insulation.
    • High bond and dielectric strength.
    • Excellent voltage-resistance and tensile strength.
    • Excellent balance of electrical, chemical and physical property.

    Datasheet

    Properties

    Unit

    Values

    KZCCPF019

    Thickness

    mm

    0.038

    Thickness Tolerance

    %

    ≤±10

    Tensile Strength

    MD

    M Pa

    ≥110

    TD

    ≥80

    Elongation

    MD/TD

    %

    ≥40

    Breakdown Strength

    KV/mm

    ≥ 120

    Peel Strength

    N/25mm

    ≥ 3

    *Corona resistance, frequency 20KHz temperature 155℃±2℃, pulse rise time 50ns

    2KV

    Min

    100

    3KV

    25

    *Volume resistivity 200+/-5c(392F)

    Ω · m

    ≥1×1013

    *Surface resistance 200+/-5c(392F)

    Ω

    ≥1×1010

    Applications

    • For Automotive Flex Circuit Cable Assemblies.
    • For Disk Drive Flex Circuit Designs.
    • For Minimizing Signal Loss at High Speeds.
    • For Satellite, Radar & Communications Systems.
    • For Space & Avionics Instrumentation.
    • Cover or Stiffener in F-PCB.
    • Polyimide Label and tubing.
    • Transformer and Motor Insulation.
    • Polyimide Adhesive tape or polyimide laminate.
    • Bar code label, machine part , electronic component , electrical insulation, COF substrates.Wire & cable Insulation, slot liner insulation, interlayer insulation in Motor, transformer etc.

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