Thermosetting polyimide coverlay film for FPCB

Short Description:

Product Description Polyimide coverlay film is a high-performance thermosetting converlay. After the Thermosetting Converlay is attached to the material which needs to be protected, a pressure of 5-10 MPa is applied by using a quick press at 170-185 ° C for about 30 seconds , then complete the operation. Structure Features The product is easy to use, only need a quick pressure, without curing later; Has good adhesion to metal, PET, PVC and other plastics; Has excellent electrical insulation...


  • Die Cutting: Available
  • Customized Solution: Available
  • Factory Inspection: Available
  • Samples Delivery day: 3 days by air express
  • Certification: SGS, ROSH, ISO
  • Product Detail

    Product Tags

    Product Description

    Polyimide coverlay film is a high-performance thermosetting converlay. After the Thermosetting Converlay is attached to the material which needs to be protected, a pressure of 5-10 MPa is applied by using a quick press at 170-185 ° C for about 30 seconds , then complete the operation.

    Structure

    polyimide Coverlay film  for FPCB structure

    Features

    1. The product is easy to use, only need a quick pressure, without curing later;
    2. Has good adhesion to metal, PET, PVC and other plastics;
    3. Has excellent electrical insulation properties;
    4. Environmental friendly, does not contain any heavy metal elements and halogen.

    Applications

    Protect flexible circuit electronic product.

    Datasheet

    Physical Characteristics Standard Values
    Model Number KZ_1012SE(C)
    Carrier Yellow PI
    Color of Adhesive Clear
    Thickness(μm) 10-12
    Storage Condition, exp date(℃,month) 25℃,6 months
    Usage Temperature(℃) 170-185℃
    Usage Pressure(MPa) 5-10
    Peel Strength(N/mm) 1.2-1.5

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